The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 1994

Filed:

Dec. 18, 1992
Applicant:
Inventors:

Tomohiro Tamaki, Osaka, JP;

Kenzo Hatada, Osaka, JP;

Hiroaki Fujimoto, Osaka, JP;

Yoshinobu Takeshita, Kagoshima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B27G / ; B31F / ; B32B / ;
U.S. Cl.
CPC ...
1563796 ; 29729 ; 29739 ; 29740 ;
Abstract

A depression jig, having a depression chip and a holder for holding the depression chip, is provided which depresses against a wiring substrate a semiconductor chip placed on the wiring substrate. The holder has portions defining penetrations vertically running through the holder. Optical fibers are inserted into the penetrations. A light ray radiates from the optical fiber. The light ray is incident upon the top surface of the depression chip, enters the depression chip, is reflected from a side surface of the depression chip onto the undersurface of the depression chip, and is emitted from the undersurface of the depression chip as an outgoing light ray. A photo-curing resin supplied between the semiconductor chip and the wiring substrate is irradiated with such an outgoing light ray, so that the photo-curing resin hardens.


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