The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
Mar. 25, 1993
Bidyut K Bhattacharyya, Chandler, AZ (US);
Jim Cattedra, Del Mar, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A test apparatus that electrically couples a semiconductor package with a test board. The apparatus has a plurality of first contacts that engage the leads of the package. The first contacts are attached to a housing which has four grounding rods spaced a predetermined distance from the first contacts. The rods are electrically grounded and absorb the inductive fields generated by the first contacts in contact with the power and ground leads of the package. The rods extend around the package to control the inductance of the first contacts of the apparatus. The test apparatus may also have a circuit board connected to the first contacts by a plurality of second contacts. A number of spring biased pins are incorporated to couple the circuit board to the test board. The circuit board has both power and ground planes that are coupled to the power and ground leads of the package. The circuit board decouples the power and ground leads and controls the capacitance of the first contacts of the apparatus.