The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 1994
Filed:
Jan. 27, 1993
Applicant:
Inventors:
Bernd K Appelt, Apalachin, NY (US);
Irv Memis, Vestal, NY (US);
Richard A Schumacher, Endicott, NY (US);
John M Lauffer, Waverly, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 257713 ; 361713 ; 361764 ;
Abstract
A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.