The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 1994
Filed:
Sep. 21, 1992
Chiaki Takubo, Yokohama, JP;
Hiroshi Tazawa, Tokyo, JP;
Yoshiharu Tsuboi, Tokyo, JP;
Masao Mochizuki, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor device, which uses a film carrier, comprises a semiconductor element with a plurality of terminals, a resin film with a first surface and a second surface, the film having a hole in which the semiconductor element is mounted, and a plurality of lead wires formed on the first surface of the resin film. Each lead wire has an inner lead, an intermediate lead and an outer lead. The inner lead is connected to a corresponding one of the terminals of the semiconductor element. The outer lead is connected to a corresponding external electrode. The intermediate lead is situated between the inner lead and the outer lead. At least said intermediate lead is formed on the first surface of the film. Each outer lead and that portion of the intermediate lead, which is close to the outer lead, is substantially on a level with the external electrode.