The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1994
Filed:
Jun. 17, 1992
Masahiko Takikawa, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A HEMT type semiconductor device includes a semiconductor substrate, a buffer semiconductor layer formed on the substrate, a first semiconductor well layer formed on the buffer layer and serving as a first conductivity type channel layer, a second semiconductor well layer formed on the first well layer and serving as a second conductivity type opposite the first conductivity, a channel layer and a potential barrier layer formed on the second well layer and forming a potential barrier for carriers. The substrate is made of GaAs or InP, and the layers are successively and epitaxially grown on the substrate. A two dimensional hole gas and a two dimensional electron gas are confined in the first well layer and in the second well layer, respectively.