The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 1994
Filed:
May. 06, 1992
Akimi Miyashita, Toride, JP;
Hazime Sato, Iwamamachi, JP;
Mutsumasa Fujii, Chiyodamachi, JP;
Isao Koromegawa, Tsuchiura, JP;
Katsunori Shibata, Kashiwa, JP;
Hitachi Techno Engineering Co., Ltd., Tokyo, JP;
Abstract
A high vacuum hot press for producing a multi-layer board. The high vacuum hot press includes a pair of heat insulating members each comprising a heat insulating material and a thin metallic cover defining an evacuated hermetic space accommodating therein the heat insulating material. The heat insulating members are arranged on respective surfaces, facing each other on a pair of bolsters. A pair of hot plates are placed on the heat insulating members, respectively. A multi-layer workpiece is disposed between the hot plates in a sealed space in a sealing unit. The multi-layer work includes wafers and an adhesive base material. The sealed space is evacuated to a high vacuum by an evacuating unit, and the multi-layer workpiece is heated by a heating unit under a high vacuum. The high vacuum hot press is further provided with a bonding unit which shifts the bolsters relative to each other to open and close the sealing unit and to bond the wafers of the multi-layer workpiece to each others for producing the multi-layer board.