The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 1994
Filed:
Dec. 10, 1992
Applicant:
Inventors:
Yoshiharu Tsujimoto, Sanda, JP;
Iku Takenaka, Otsu, JP;
Hiromitsu Onishi, Itami, JP;
Edward K Chang, Gillette, NJ (US);
Assignee:
Osaka Sanso Kogyo Ltd., Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
228219 ; 228224 ;
Abstract
A method of soldering for surface mounting of a printed circuit board, which comprises performing reflow soldering with a rosin-based cream solder in a special atmospheric gas comprising an inert gas such as N.sub.2, Ar or He and containing about 10,000 ppm or less of oxygen and 0.5-3.0% of moisture is disclosed.