The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 1994
Filed:
Nov. 27, 1991
Saiden Chemical Industry Co., Ltd., Tokyo, JP;
Lintec Corporation, Tokyo, JP;
Abstract
The pressure sensitive adhesive composition is favorably utilized for lamination of plastic molded articles, particularly molded articles of polycarbonate resins and molded articles of acrylic resins because formation of blisters, such as bubbles and liftings, is prevented. It is favorably utilized for pressure sensitive adhesive sheets for surface protection because increase of adhesive strength is small, staining of the surface of the substrate is prevented and removability is excellent. It is also favorably utilized for electric insulation tapes because corrosion resistance, creep property and solvent resistance are excellent. The pressure sensitive adhesive composition comprises as the main component thereof a specific acrylic copolymer prepared by copolymerization of a specific methyleneamine derivative of acrylamide, a specific amine derivative of acrylimide, a specific diacetone derivative of acrylamide and a specific ester of acrylic acid.