The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 1994
Filed:
May. 26, 1992
Farhad Farassat, Taufkirchen, DE;
F&K Delvotec Bondtechnik GmbH, Oberhaching, DE;
Abstract
A device for incorporation in a wire bonding machine for monitoring the supply of wire from a wire supply spool to a bonding wedge. The device includes a mount (12) for rotatably mounting a wire supply spool (1); a guide wheel (7) mounted on a lever (8), which lever (8) can be deflected between a first position to which it is biassed by a spring (10) and a second position at which it activates sensor (A); and a motor (3) for driving the wire supply spool (1), which motor (3) is started by the sensor (A) when the sensor is activated by the lever (8). The device further comprises a means for stopping the motor (3) when a predetermined amount of wire (6) has been supplied. The wire (6) passes over the guide wheel (7) between the wire supply spool (1) and the bonding wedge so that the consumption of wire during a bonding cycle causes deflection of the lever (8) from its first position to its second position. The device makes it possible for the operator of the wire bonding machine to have available information about wire consumption and wire supply, in order to provide improved control of the bonding process.