The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 1994
Filed:
Mar. 24, 1993
Nobuto Yamazaki, Tokyo, JP;
Mitsuaki Sakakura, Saitama, JP;
Koichi Harada, Tokyo, JP;
Minoru Torihata, Saitama, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A wire bonding apparatus in fabricating, for example, semiconductor devices including a bonding arm that is vertically and horizontally movable and has a capillary through which a bonding wire is passed. The bonding arm is provided with a piezoelectric element which transmits a vibration to the capillary via its electric strain effect or magnetic strain effect so that the capillary performs wire bonding. With the use of the piezoelectric element that is provided near the capillary, vibrational energy loss can be minimal, and the frequency and amplitude of the vibration can be changed during each bonding operation.