The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 1994
Filed:
Oct. 18, 1991
Dainippon Screen Mfg. Co., Ltd., Kyoto, JP;
Abstract
A dipping type wafer treatment apparatus includes a treatment solution bath capable of forming a uniform rising flow of a treatment solution inside from an inlet to an outlet, a treatment solution supplying unit for supplying a treatment solution at a constant velocity to the inlet of the treatment solution bath to form a uniform rising flow of the treatment solution inside the treatment solution bath and a device for dipping and retrieving the wafer into and out of the uniform flow of the treatment solution. The treatment solution is supplied from the inlet in the treatment solution bath and drown off through an outlet of the treatment solution bath. Accordingly, the treatment solution can be rapidly substituted, and the wafers to no experience contact with air during replacement of the treatment solutions.