The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 1993

Filed:

Mar. 29, 1993
Applicant:
Inventors:

Gurtej S Sandhu, Boise, ID (US);

Alan E Laulusa, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23F / ; C03C / ;
U.S. Cl.
CPC ...
156638 ; 156646 ; 156656 ; 156345 ;
Abstract

The present invention remedies the problems associated with selective etching of material, and in particular tungsten, by locally removing the material (e.g. tungsten) from the alignment marks through wet etching without the need for any photo steps. Either before or after chemical mechanical polishing, the wafers are flatly aligned and a tungsten etching agent is introduced through an etchant dispensing apparatus onto the alignment marks. Since an alignment mark is normally a few hundred microns in size and there is a large unused silicon real estate around the alignment marks, the alignment constraints vis-a-vis etchant dispensing apparatus and wafer are not very critical and tungsten plugs in the live dice are easily protected from the wet etch. After the etch, the etching byproduct is removed by suction and the wafer is cleaned by being rinsed in distilled water.


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