The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 1993

Filed:

Jun. 19, 1992
Applicant:
Inventors:

Sanjay S Talreja, Citrus Heights, CA (US);

Peter K Hazen, Sacramento, CA (US);

Sherif R Sweha, El Dorado Hills, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C / ;
U.S. Cl.
CPC ...
365185 ; 36523003 ; 365218 ; 36518901 ;
Abstract

A nonvolatile memory device residing on a substrate is described. The memory device includes a first block and a second block. The first block includes a first sub-block comprising a first memory cell, a first bit line coupled to a drain of the first memory cell, and a first source line coupled to a source of the first memory cell. The first block also includes a second sub-block which includes a second memory cell, a second bit line coupled to a drain of the second memory cell, and a second source line coupled to a source of the second memory cell. The second block comprises a third sub-block comprising a third memory cell, a third bit line coupled to a drain of the third memory cell, and a third source line coupled to a source of the third memory cell. The second block also includes a fourth sub-block which includes a fourth memory cell, a fourth bit line coupled to a drain of the fourth memory cell, and a fourth source line coupled to a source of the fourth memory cell. The first sub-block of the first block and the third sub-block of the second block are grouped together on the substrate to form a first data bit group corresponding to a first data pin of the memory device such that the distances of the first and third memory cells of the first data bit group to a first sensing circuit are substantially minimized and are substantially equal. The second sub-block of the first block and the fourth sub-block of the second block are grouped together on the substrate to form a second data bit group corresponding to a second data pin of the memory device such that the distances of the second and fourth memory cells of the second data bit group to a second sensing circuit are substantially minimized and are substantially equal.


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