The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 1993

Filed:

Feb. 06, 1992
Applicant:
Inventors:

Noriyuki Yamamoto, Kariya, JP;

Yuri Otobe, Kariya, JP;

Takanori Okabe, Kariya, JP;

Minoru Kato, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257629 ; 257136 ; 257508 ; 257620 ; 257787 ;
Abstract

In a semiconductor apparatus and method for producing the same where an upper surface of a semiconductor chip having a thick film electrode is coated with a passivation film, the semiconductor chip being molded with a resin mold such as a power SIT, a conductive film made of a doped polysilicon, a metal material, or the like and which has a thickness of for example 3000 angstroms or more is circumferentially disposed from a bottom circumference of the thick film electrode to a part of region between a field oxide film and a passivation film so as to effectively prevent cracks in the passivation film caused by a cyclic temperature test from extending into the field oxide film.


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