The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1993
Filed:
Nov. 05, 1992
Sowjun Matsumura, Hirakata, JP;
Tadashi Chiba, Hirakata, JP;
Yoshiko Hotta, Hirakata, JP;
Itsuji Yoshikawa, Toyonaka, JP;
C. Uyemura & Co., Ltd., Osaka, JP;
Osaka Cement Co., Ltd., Osaka, JP;
Abstract
A composite deposit in which insoluble particles are co-deposited and dispersed in a metal matrix is formed on an article by dipping the article in a metal plating solution having insoluble particles dispersed therein and effecting an electroplating or chemical plating process. By adjusting the specific surface area of insoluble particles to be dispersed in the metal plating solution, the amount of insoluble particles co-deposited in the composite deposit can be controlled. Better results are obtained with insoluble particles having a specific surface area of 10 m.sup.2 /g or less.