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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5259548 B1

PDFFull Text
Date of Patent:
Nov. 09, 1993

Filed:

Jun. 19, 1992

Wire bonding method

Applicant:
Inventors:

Nobuto Yamazaki, Tokyo, JP;

Kazuo Sugiura, Tokyo, JP;

Minoru Torihata, Tokyo, JP;

Kuniyuki Takahashi, Tokyo, JP;

Tatsunari Mii, Tokyo, JP;

Assignee:

Kabushiki Kaisha Shinkawa, Tokyo, JP;

Attorney:

Koda and Androlia

Primary Examiner:

Kenneth J Ramsey

Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
2281805 ;
Abstract

In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.

Find Patent Forward Citations

Yamazaki, Nobuto. (1993). Wire bonding method (U.S. Patent No. 5259548). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5259548

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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