The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1993
Filed:
Nov. 07, 1991
Yoshihiro Kashiba, Amagasaki, JP;
Masaru Okada, Amagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for producing a ceramic-metal composite substrate, which comprises integrally bonding together a ceramic base member, metal members of a material selected from the group consisting of copper and alloys thereof, and a constraining member to be bonded to the metal member, wherein improvement comprises: bringing the metal member into close contact with ceramic base member through a thin film layer having a thickness of from 0.1 .mu.m to 3 .mu.m and containing therein an active metal; and heating the combination of the ceramic base member, the metal member, and the constraining member in an atmosphere which is difficult to react with the active metal, to a temperature ranging from a melting point of an alloy to be formed of the metal member and the active metal to a temperature below the melting point of the metal member, while applying a pressing force to combination in the direction of its thickness, thereby realizing the integral bonding.