The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1993
Filed:
Jan. 24, 1992
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device having small diameter via-holes, particularly not greater than 0.6 microns, for a multilayer interconnection is produced by a method comprising covering an interlayer film and via-holes with a continuous, first metal film by a CVD process, and heating and melting by an irradiation of an energy beam a second metal film deposited on the first film by a PVD process, together with the first metal film, to fully fill the via-holes with the material from the outside of the holes, to thus form conductive plugs therein. The deposition of the material of the second metal film and the filling of the via-holes may be simultaneously performed by a high temperature sputtering process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile