The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1993
Filed:
Nov. 27, 1991
Naokatsu Suwanai, Koganei, JP;
Hiroyuki Miyazawa, Kodaira, JP;
Atushi Ogishima, Kodaira, JP;
Masaki Nagao, Koganei, JP;
Kyoichiro Asayama, Tachikawa, JP;
Hiroyuki Uchiyama, Kodaira, JP;
Yoshiyuki Kaneko, Kokubunji, JP;
Takashi Yoneoka, Irving, TX (US);
Kozo Watanabe, Kodaira, JP;
Kazuya Endo, Kokubunji, JP;
Hiroki Soeda, Koganei, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a semiconductor memory circuit device wherein each memory cell is constituted by a series circuit of a memory cell selecting MISFET and an information storing capacitor of a stacked structure, there are present in a first region, which is a memory cell array region, a first MISFET having a gate electrode and source and drain regions; first and second capacitor electrodes and a dielectric film extended over a first insulating film and over the gate electrode; a second insulating film disposed on the second capacitor electrode; a third insulating film interposed between the first insulating film and first capacitor electrode; and a first wiring positioned on the second insulating film. In a second region of the device, which is a peripheral circuit region, there are present a second MISFET having a gate electrode and source and drain regions; a first insulating film on the gate electrode; a second insulating film on a third insulating film, the third insulating film being interposed between the first and second insulating films; and a second wiring on the second insulating film. The second wiring is formed by the same level conductor layer as that forming the first wiring. Similarly, the first through third insulating films of the first region are correspondingly associated with the first through third insulating films of the second region, respectively.