The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1993
Filed:
Apr. 30, 1990
Applicant:
Inventors:
Lowell H Holschwandner, Fountain Hill, PA (US);
Virendra V Rana, South Whitehall Township, Lehigh County, PA (US);
Assignee:
AT&T Bell Laboratories, Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437192 ; 437190 ; 437194 ; 437246 ;
Abstract
The adhesion of tungsten to an underlying dielectric layer is improved by the use of a thin glue layer of either TiN or Al.
Quick Actions:
Holschwandner, Lowell. (1993). Tungsten metallization (U.S. Patent No. 5227335). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5227335
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile