The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1993
Filed:
Aug. 05, 1991
Applicant:
Inventors:
Tetsujiro Yoshiharu, Amagasaki, JP;
Haruo Kamise, Kishima, JP;
Assignees:
Osaka Titanium Co., Ltd., Amagasaki, JP;
Kyushu Electronic Metal Co., Ltd., Saga, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428 64 ; 428 66 ; 428192 ; 428212 ; 428216 ; 428446 ; 428698 ; 428699 ; 428704 ; 148 333 ; 148D / ; 437 95 ; 437238 ; 437946 ; 437947 ;
Abstract
A semiconductor wafer on which silicon or the like is epitaxially grown and p-type or n-type impurities are doped and which has at the rear surface except for the peripheral edge portion thereof a blocking film for preventing jumping out of impurities therefrom which causes auto-doping, thereby preventing silicon particles from being produced at the peripheral surface and preventing the semiconductor wafer from being contaminated by the silicon particles during the manufacturing a semiconductor device.