The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
Nov. 04, 1991
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device includes an insulating substrate; a semiconductor chip on which plural electrodes including at least one ground electrode and at least one power source electrode are disposed; plural leads supported by an obverse surface of the insulating substrate, the plural leads being connected to corresponding electrodes on the semiconductor chip; at least one grounding conductor plate on a reverse surface of the insulating substrate; and at least one power source conductor plate on the reverse surface of the insulating substrate. This semiconductor device includes grounding contact holes for electrically connecting the grounding conductor plate to a ground lead coupled to the ground electrode on the semiconductor chip; power source contact holes for electrically connecting the power source conductor plate to a power source lead coupled to the power source electrode on the semiconductor chip; and a package body encapsulating the semiconductor chip and an end of each of the leads so that the other end of each of the leads is exposed outside the package body.