The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1993
Filed:
Mar. 02, 1992
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device (10) having first and second wiring layers (30, 33) on opposite surfaces of a carrier substrate (12) interconnected through vias (32) formed in the carrier substrate (12) electrically coupling an electronic component (18) to a mounting substrate through compliant solder balls (26) displaced away from vias (32), the semiconductor device (10) characterized by a standard size carrier substrate (12) having high performance electrical package interconnections (24) and good heat dissipation. Improved electrical performance is obtained by providing independent wiring layers (30, 33) each having a lead trace layout specifically designed for a particular electronic component (18) and a particular board connection requirement while using a standard size package outline. Assembly costs are reduced by providing a plastic package mold (36) over a standard size carrier substrate (12) capable of supporting a variety of different electronic components (18) themselves having varying dimensions.