The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 1993

Filed:

Feb. 24, 1992
Applicant:
Inventors:

Hirotaka Okonogi, Miyoshi, JP;

Katsutomo Nikaido, Miyoshi, JP;

Junichi Ichikawa, Miyoshi, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174264 ; 29837 ; 361400 ;
Abstract

A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.


Find Patent Forward Citations

Okonogi, Hirotaka. (1993). Printed wiring board with electromagnetic wave shielding layer (U.S. Patent No. 5210379). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5210379

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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