The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 1993
Filed:
May. 19, 1992
Applicant:
Inventors:
Koji Sato, Tokyo, JP;
Akio Bando, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228-62 ; 228 447 ; 228 51 ; 15 211 ;
Abstract
A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.