The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1993
Filed:
Dec. 06, 1991
James R Ohannes, Portland, ME (US);
Stephen W Clukey, South Portland, ME (US);
E David Haacke, Westbrook, ME (US);
Roy L Yarbrough, Hiram, ME (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
An output buffer circuit (10) delivers output signals of high and low potential levels at an output (V.sub.OUT) in response to data signals at an input (V.sub.IN). The output buffer circuit comprises an input stage (12) coupled between a relatively quiet power supply rail (V.sub.CCQ) and a relatively quiet power ground rail (GNDQ), and an output stage (14) coupled between a relatively noisy power supply rail (V.sub.CCN) and a relatively noisy power ground rail (GNDN). A first coupling resistor (R5) is coupled between the relatively quiet and noisy supply rails (V.sub.CCQ, V.sub.CCN) for reducing V.sub.CC droop in the relatively noisy supply rail (V.sub.CCN) which in turn reduces output step in voltage during transition from low to high potential level (LH) at the output (V.sub.OUT). A second coupling resistor (R5A) is coupled between the relatively quiet and noisy ground rails (GNDQ,GNDN). The coupling resistors (R5 and R5A) have low resistance values selected for partially coupling the supply and ground rails respectively, while maintaining partial isolation for protecting input dynamic threshold levels of quiet outputs. The first coupling resistor (R5) is coupled between supply rail bond pads (20,22), while the second coupling resistor (R5A) is coupled between ground rail bond pads (30,32). The power rail bond pads (20,22) (30,32) are coupled respectively to split leads (24,25) (34,35) of a split lead leadframe merging respectively to a common V.sub.CC pin (28) and a common GND pin (38).