The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1993
Filed:
Sep. 19, 1991
Applicant:
Inventors:
Keiji Toei, Kyoto, JP;
Yasuyoshi Miyaji, Kyoto, JP;
Masanobu Sato, Kyoto, JP;
Akihiro Inagaki, Shiga, JP;
Seiji Tonogai, Shiga, JP;
Koichi Omoto, Shiga, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23F / ;
U.S. Cl.
CPC ...
156640 ; 156644 ; 156645 ; 156651 ; 156654 ; 1566611 ; 156345 ;
Abstract
A method of forming small through-holes in a thin metal layer including the steps of forming resist films having openings formed in accordance with a predetermined pattern; etching one or both sides of the thin metal plate and stopping etching before through-holes are formed; removing the overhang of the resist film by spraying high pressure fluid onto the etched side of the thin metal plate; covering the surface by an etch-resisting layer; forming through-holes by etching the side not covered; and stripping the etch-resisting layer and the resist film.