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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5196917 B1

PDFFull Text
Date of Patent:
Mar. 23, 1993

Filed:

Dec. 04, 1989

Carrier tape

Applicant:
Inventors:

Tetsuya Ueda, Itami, JP;

Kou Shimomura, Itami, JP;

Osamu Nakagawa, Itami, JP;

Seiji Takemura, Itami, JP;

Kazunari Michii, Itami, JP;

Assignee:

Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;

Attorney:

Leydig, Voit & Mayer

Primary Examiner:

Robert J Pascal

Assistant Examiner:

R A Ratliff

Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 80 ;
Abstract

A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip. The resultant chip is placed within a cavity of a mold, and a molten resin is injected into the cavity through the opening or recess passage formed in the link portion of the film.

Find Patent Forward Citations

Ueda, Tetsuya. (1993). Carrier tape (U.S. Patent No. 5196917). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5196917

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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