The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1993
Filed:
Feb. 19, 1991
Applicant:
Inventors:
Assignee:
Nippon Cmk Corp., , JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; H01Q / ;
U.S. Cl.
CPC ...
427 96 ; 29601 ; 174264 ;
Abstract
A method for connecting a ground circuit and an electromagnetic wave shielding layer for a printed wiring circuit in a printed circuit board is disclosed. The method comprising the steps of forming said insulating layer by a plurality of insulating layers and gradually increasing from the printed wiring circuit side to the electromagnetic wave shielding layer side, a diameter of an aperture of the ground circuit of each insulating layer in the process for forming the insulating layer.
Okonogi, Hirotaka. (1993). Method for connecting an electromagnetic wave shielding layer with a (U.S. Patent No. 5196230). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5196230
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