The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1993
Filed:
Dec. 17, 1991
Yasuyuki Nakaoka, Amagasaki, JP;
Minoru Fujita, Amagasaki, JP;
Toshikazu Izumo, Nagasaki, JP;
Tsuyoshi Watanabe, Nagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A dispersion plating method in which plating is conducted while plating liquid containing both abrasive grains of a size larger than 10 .mu.m and another grains is brought into contact with the surface of an object to be plated, the latter grains then being removed by washing with water with only abrasive grains being entrapped in a metal matrix. Plating liquid is circulated through a filter of a filtering size smaller than the average grain size of abrasive grains and the abrasive grains are made into a flocculating condition and adhered to the surface of object to be plated. Furthermore, abrasive grains are adhered to the surface of object to be plated in a plating thickness of less than one half of average grain size of abrasive grains.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile