The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 1993
Filed:
Jun. 29, 1990
Applicant:
Inventors:
Kazuyoshi Ebe, Saitama, JP;
Hiroaki Narita, Saitama, JP;
Katsuhisa Taguchi, Saitama, JP;
Yoshitaka Akeda, Saitama, JP;
Takanori Saito, Saitama, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J / ; C09J / ; C09J / ;
U.S. Cl.
CPC ...
428343 ; 427516 ; 428345 ; 428355 ;
Abstract
An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.