The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 1992
Filed:
Mar. 15, 1991
Junzaburo Shirai, Saitama, JP;
Nippon CMK Corp., , JP;
Abstract
A method of manufacturing a printed wiring board on a cubically molded substrate enables formation of high-precision printed circuits fully compatible with the complex configuration of the cubic substrate. The manufacturing method includes initially forming a conductive layer on the surface of a cubic substrate followed by etching the conductive layer. The method includes the steps of forming electrodeposited resist on the conductive layer, exposing the electrodeposited resist to parallel light beams through a planar photomask, and etching the conductive layer to complete the formation of the printed circuit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile