The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1992
Filed:
Oct. 02, 1990
Hitachi Techno Engineering Co., Ltd., Tokyo, JP;
Abstract
A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.