The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1992
Filed:
Apr. 26, 1991
Evert M Kamerbeek, Eindhoven, NL;
Albertus J van der Borst, Eindhoven, NL;
Poul K Larsen, Eindhoven, NL;
Johannes J van der Leek, Eindhoven, NL;
Wilhelmus C Meerman, Eindhoven, NL;
Nicolaas H Van Stiphout, Eindhoven, NL;
U.S. Philips Corporation, New York, NY (US);
Abstract
A device is set forth for interrupting a material flow by means of a shutter 5 fastened on a spindle 11, which spindle 11 is rotatably supported in a housing 1 of the device. The device is provided with a torsion spring 33 which is elastically deformable through rotation of the spindle 11, with substantially equal amounts of mechanical energy being stored in the torsion spring 33 through elastic deformation in a first position of the shutter 5. The material flow is shut off during this operation, and in a second position of the shutter 5 the material flow begins. The spindle 11 is provided with a permanent magnet 57 having pole shoes 61, 63 which are held against stops 109, 115 of a magnetic yoke 99 in the first position under the influence of the magnetic field of the magnet 57, and which are held against stops 111, 113 of the yoke 99 in the second position. The yoke 99 is provided with an electric coil 121. The shutter 5 is displaceable from a rest position to one of the two positions by an alternating current in the coil 121, whereas a direct current in the coil 121 attenuates the magnetic field of the magnet 57, so that the shutter 5 is displaced from the relevant position to the other position under the influence of the torsion spring 33. The device is suitable for use in a system for the deposition of materials in the form of thin layers on substrates. In such a system, the shutter 5 periodically interrupts a material flow coming from a source of material and aimed at the substrate, so that a desired composition of the layer is obtained.