The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 1992

Filed:

Dec. 20, 1990
Applicant:
Inventors:

Haruo Mishina, Ushiku, JP;

Shinya Yamama, Abiko, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228219 ; 228 42 ; 228242 ;
Abstract

In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.


Find Patent Forward Citations

Mishina, Haruo. (1992). Vapor reflow type soldering method and apparatus therefor (U.S. Patent No. 5156325). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5156325

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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