The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 1992
Filed:
Oct. 02, 1990
Applicant:
Inventors:
Haruo Mishina, Ushiku, JP;
Shinya Yamama, Abiko, JP;
Assignee:
Hitachi Techno Engineering Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F26B / ;
U.S. Cl.
CPC ...
34 78 ; 432194 ; 118729 ; 118 61 ;
Abstract
A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.