The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 1992

Filed:

Mar. 26, 1990
Applicant:
Inventor:

Christopher J LeBeau, Tempe, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B / ; H04N / ; G06K / ;
U.S. Cl.
CPC ...
356394 ; 382-8 ; 382 22 ; 356237 ; 358106 ; 358107 ;
Abstract

A real time automatic visual semiconductor package inspection method is provided wherein a direction edge enhancement is performed on an image of the package. The direction edge enhanced image is dilated and correlated to a stored direction edge shape to identify all shapes of interest in a package under inspection. Also, anomalous shapes and uncorrelated direction edge shapes are identified and dilated. The dilated direction edge shape is analyzed using relatively simple mathematic techniques such as counting the number of shapes of a particular type, transforming shapes of interest to identify points of interest, and measuring relative position between the points of interest to determine acceptability of the semiconductor package. Also, size and location of anomalous shapes are calculated to determine acceptability of the package.


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