The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 1992
Filed:
Jun. 01, 1990
Applicant:
Inventors:
Mark D Evans, Rochester, NY (US);
John R Debesis, Penfield, NY (US);
Wesley H Bacon, Rochester, NY (US);
Assignee:
Eastman Kodak Company, Rochester, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F / ; G03C / ;
U.S. Cl.
CPC ...
430313 ; 430318 ; 430329 ; 156643 ; 156650 ; 427 96 ; 427259 ;
Abstract
In a microbump flip-chip mounting method, microcircuit features such as conductors and microbumps are formed by a lift off process. A first refractory metal is employed to promote adhesion between a layer of aluminum deposited by physical vapor deposition and a second refractory metal is employed to promote adhesion between the aluminum and an overlying layer of gold.