The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 1992

Filed:

Dec. 28, 1989
Applicant:
Inventors:

Ranee W Kwong, Wappingers Falls, NY (US);

Harbans S Sachdev, Wappingers Falls, NY (US);

Krishna G Sachdev, Wappingers Falls, NY (US);

Assignee:

IBM Corporation, Armonk, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ; C08G / ; C08J / ; G03C / ;
U.S. Cl.
CPC ...
430192 ; 252600 ; 522 39 ; 522 47 ; 522 50 ; 430197 ; 430270 ;
Abstract

New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.


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