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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5112648 B1

PDFFull Text
Date of Patent:
May. 12, 1992

Filed:

Apr. 09, 1991

Method of manufacturing a printed circuit board

Applicant:
Inventors:

Hirotaka Okonogi, Saitama, JP;

Katsutomo Nikaido, Saitama, JP;

Junichi Ichikawa, Saitama, JP;

Yoshio Nishiyama, Saitama, JP;

Assignee:

Nippon CMK Corp., , JP;

Attorneys:

Adams; Bruce L.

Wilks; Van C.

Primary Examiner:

P W Echols

Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 96 ; 29620 ; 174 / ; 174255 ; 174259 ;
Abstract

A method of manufacturing a printed circuit board is disclosed. The method comprises steps of providing a substrate for the printed circuit board, forming circuit patterns on one or both sides of the substrate, and shielding the whole or a required part of the circuit patterns by using a shield layer in such a manner that the shield layer and a grounding circuit of the circuit patterns are connected through a resistor. This method of manufacturing a printed circuit board is improved so that adhesion between the shield layer and the junction land of the grounding circuit is enhanced by the joining of the shield layer to the junction land of the grounding circuit through the resistor, and that the noise preventive action of the shield layer is improved by the attenuating of electromagnetic-wave energy received by the shield layer which is to be discharged as electrical current to the grounding circuit. For example, such improvement is made by using a resistor having a resistance value higher than that of said shield layer and/or made of a conductive material mainly composed of carbon or copper or both.

Find Patent Forward Citations

Okonogi, Hirotaka. (1992). Method of manufacturing a printed circuit board (U.S. Patent No. 5112648). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5112648

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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