The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 1992

Filed:

Nov. 09, 1990
Applicant:
Inventor:

Hung-Kwei Hu, Saratoga, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F / ;
U.S. Cl.
CPC ...
430328 ; 430330 ; 430331 ; 430394 ;
Abstract

A controllable feature shrinkage technique permits shrinkage of feature sizes beyond the capability of current lithographic tools by using high temperature flow to shrink the conventionally formed resist image of the feature and then deep UV exposure to stabilize the resist profile at the desired reduced size. A preliminary partial stabilization using hard bake and low intensity deep UV exposure reduces the rate of resist flow at temperature, permitting better control and repeatability of the amount of shrinkage. Feature sizes in the range of about 0.15 .mu.m may be achieved.


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