The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1992
Filed:
Nov. 30, 1990
Applicant:
Inventor:
Tohru Takamura, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41F / ; B41F / ;
U.S. Cl.
CPC ...
101163 ; 101287 ;
Abstract
A thin film supplier for supplying ink, paste etc., used in relief-plate printing devices, die bonders etc., including an original printing plate placed on a table. The printing plate is provided with a through hole, and a bridge piece is placed in this hole. A recess is formed in the through hole by the bridge piece which has a thickness less than that of the printing plate, and ink, paste, etc. is poured into the recess so that a relief printing plate attached to a plate holder is immersed in such ink, paste, etc.
Takamura, Tohru. (1992). Thin film supplying mechanism (U.S. Patent No. 5095817). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5095817
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile