The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1992
Filed:
Sep. 28, 1989
Akira Tanaka, Katsuta, JP;
Hirokazu Inoue, Ibaraki, JP;
Kazuji Yamada, Hitachi, JP;
Kunio Miyazaki, Hitachi, JP;
Osamu Miura, Hitachi, JP;
Hideo Arakawa, Hitachi, JP;
Hiroshi Yokoyama, Hitachi, JP;
Yoshio Naganuma, Hitachi, JP;
Atsushi Morihara, Katsuta, JP;
Katsunori Ouchi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.