The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1992
Filed:
Mar. 09, 1990
Kenzo Hatada, Katano, JP;
Takeshi Ishihara, Neyagawa, JP;
Nobuaki Suzuki, Osaka, JP;
Satowaka Kuroda, Osaka, JP;
Matsushita Electric Industrial Co. Ltd., Osaka, JP;
Martec Corporation, Mino, JP;
Abstract
Tests of a semiconductor IC is conducted first by bringing a plurality of conductive pattern circuits formed on an insulator sheet into contact with a plurality of bump electrodes formed on a substrate of the semiconductor, second by connecting a plurality of signal transmission pattern circuits formed on a transmission circuit substrate with each conductive pattern circuit of the insulator sheet, and then by connecting the transmission circuit substrate with a body of the testing device. A probing test can be simplified since there is no need to manually adjust positions of conventional probe needles. Further, semiconductor ICs having a lot of bump electrodes can be test without being damaged.