The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1992
Filed:
Jul. 17, 1989
Asahi Kasei Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
The present invention relates to the high-sensitivity thermosensitive multilayer film and the method to produce plate-making paper using the film. In the present invention, the high-sensitivity thermosensitive multilayer film consists of at least one functional layer and at least one peeling layer. The said functional layer is made of the thermoplastic resin layer with the thickness of 0.1 to 12 .mu.m and with at least 30% of a thermal shrinkage rate and at least 50 g/mm.sup.2 of thermal shrinkage stress value. The peeling layer consists of the thermoplastic resin layer which is different from that of the functional layer and is the special multilayer film which is readily releasable and capable of exerting a compressive force to the functional layer. When the stencil sheet is manufactured by using the said multilayer film, the operation efficiency at time of lamination and the shrinkage capacity can improve by peeling the said peeling layer after lamination from porous supporting member. Moreover the resistance of the original paper to curling is remarkably enhanced under a high temperature circumstances by removing the compressive force working on the functional layer as result of peeling the peeling layer after lamination if the compressive force exists at the said peeling layer.