The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 1991
Filed:
Oct. 02, 1990
Yoshio Oshima, Tokorozawa, JP;
Yasushi Ishii, Kodaira, JP;
Hideki Hidaka, Hino, JP;
Kunihiro Tsuchiya, Choufu, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Tokyo Electronics Co., Ltd., Ohme, JP;
Abstract
A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.