The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1991
Filed:
Apr. 16, 1990
Applicant:
Inventors:
Nobuto Yamazaki, Tachikawa, JP;
Akihiro Nishimura, Hachioji, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228110 ; 228179 ; 228904 ;
Abstract
Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connecting the tip end to the electrode, and then pulling the wire away from the electrode to cut the wire, leaving the tip end on the electrode.
Yamazaki, Nobuto. (1991). Method for forming bump on semiconductor elements (U.S. Patent No. 5058798). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5058798
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile