The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 1991
Filed:
Jan. 28, 1991
Applicant:
Inventors:
Lawrence S Mok, Yorktown Heights, NY (US);
Robert E Schwall, Ridgefield, CT (US);
Ho-Ming Tong, Yorktown Heights, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H02B / ; H05K / ;
U.S. Cl.
CPC ...
357 81 ; 357 75 ; 357 79 ; 357 80 ; 361381 ; 361386 ; 361389 ;
Abstract
In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.
Quick Actions:
Mok, Lawrence. (1991). Electronic device and heat sink assembly (U.S. Patent No. 5057909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5057909
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile