The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 1991

Filed:

Oct. 12, 1990
Applicant:
Inventors:

Hongzong Chew, Allentown, PA (US);

Catherine A Fieber, Upper Milford Township Lehigh County, PA (US);

Graham W Hills, Salisbury Township Lehigh County, PA (US);

Edward P Martin, Jr, Bethlehem, PA (US);

Assignee:

AT&T Bell Laboratories, Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156643 ; 1566611 ; 430317 ;
Abstract

In a two-step etching process for making tapered contact openings in a dieletric, a thin layer of a material is interposed to serve as an adhesive between the dielectric and a photoresist layer the thin layer of material is chosen to remain essentially intact during undercut partial etching of the dielectric. As a result of enhanced adhesion, the photoresist layer remains more accurately positioned for subsequent anisotropic etching across the remainder of the thickness of the dielectric.


Find Patent Forward Citations

Chew, Hongzong. (1991). Method of taper-etching with photoresist adhesion layer (U.S. Patent No. 5057186). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5057186

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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