The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 1991
Filed:
Apr. 16, 1990
Applicant:
Inventors:
Nobuto Yamazaki, Tokyo, JP;
Akihiro Nishimura, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
29860 ; 29827 ; 228 51 ; 2281801 ; 361409 ;
Abstract
Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.